Stripper
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SPR Series
Bumping Stripper
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Bumping strippers are formulated chemicals designed specifically for the
removal of wet film and dry film and have less metal damage for bumping
process.
Inquiry for technical data sheet
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Cleaner
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FCS series
Flux Cleaner
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FCS series are flux cleaner with the uniquely formulated chemistry designed
specially for removal of flux. This excellently performing stripper could
rapidly remove flux without damage to Cu and Sn in bumping process.
Inquiry for technical data sheet
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Plating
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CPM solution
Cu Pillar Bump plating
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Pillar bump CPM series solution is formulated chemicals designed specifically
for Cu plating in the Pillar Bump process. Pillar bump CPM solution are
formulas based on H2SO4, CuSO4 5H2O and organic additives, and provide
appropriate secondary current distribution to satisfy bumping process application.
Inquiry for technical data sheet
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CPM solution
Cu RDL plating
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RDL CPM solution is formulated chemicals designed specifically for Cu
plating in the RDL process. RDL CPM solution are formulas based on H2SO4,
CuSO4 5H2O and organic additives, and provide appropriate secondary current
distribution to satisfy bumping process application.
Inquiry for technical data sheet
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