Etchant

Al Etch series
Al Etchant

Al Etch series are functional chemicals designed specifically for etching of Al(alloy), Mo(Nb)/Al(Nd), Mo(Nb)/Al(Nd)/Mo(Nb). Al Etch series are formulas based on H3PO4, HNO3 and CH3COOH and provide appropriate etching profile to satisfy process application.
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BOE & BHF Series Etchant

BOE and BHF are formulated chemicals designed specifically for etching of SiO2 and SiN. BHF series etchants contain surfactant, which enhances wettability and achieves etching uniformity. BOE and BHF are formulas based on HF and NH4F.
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HSE Series
High Selective Etchant 

HSE series etchants are formulated chemicals designed specifically for high selective etching for different materials, e.g. SiO2/SiN, TiSi/TiN and Si orientation<111>/<100>.
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Poly series etchant

Poly series etchants are formulated chemicals designed specifically for isotropic etching of Si. Poly series are formulas based on HF and HNO3.
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Stripper

SPR Series
IC Al Process Stripper

SPR 725, SPR 745 and SPR 745T are uniquely formulated chemistry designed specially for removal of positive PR and dry etched PR residue without damage to Al, Cu, Ti, and W for Al process in semiconductor.
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SPR Series
IC Cu Process Stripper

SPR 3100 and SPR 3200 are uniquely formulated chemistry designed specially for removal of dry etched PR residue without damage low-k, Cu, Ta, TaN and SiC in IC Cu process.
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Cleaner

Acidic type post CMP cleaning solution
CMP-M series

CMP-M series post CMP cleaning solution is formulated chemicals designed specifically for post copper and tungsten CMP cleaning. CMP-M series cleaners have outstanding cleaning performance for particles and metals and cost reduction with high dilution ratio, up to 100 times.
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Alkaline type post CMP cleaning solution
CMP-B series

CMP-B series post CMP cleaning solution is formulated chemicals designed specifically for post copper CMP cleaning with cobalt as barrier. CMP-B series cleaners have outstanding cleaning performance for particle, metal, and organic residue. It controls galvanic corrosion to barrier metals. High cost reduction POU dilution ratio more than 100 times.
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Photo ancillaries

IC Developer
ICT-D323T

High purity IC Developer are formulated chemicals designed specifically for positive tone photoresist. The developer is formulas based on high purity TMAH and surfactant, which provides good PR profile after developing.
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Thinner/EBR series

High purity EBC series are formulated chemicals designed specifically for photoresist thinning, EBR remove and PR reducing. The EBC series are formulas based on high purity solvent, which provides good PR solubility.
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Slurry

SLM-200 Series Slurry                                                   

SLM-200 series are colloidal silica-based slurries with the uniquely formulated chemistry designed specially for wafer polishing. SLM-200 series are formulated using colloidal silica with chemical additives to achieve specific performance requirements.
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