KANTO-PPC collaborates closely with packaging customers to meet their unique needs in advanced packaging processes like CoWoS, InFO, and SoIC. Our R&D team consistently innovates to design products that are both high-performing and environmentally friendly, aligning with the current market trend of sustainability. KANTO-PPC has long been recognized not just as a leader in high-purity electronic chemicals but also as a trusted and reliable partner for our clients.






Products for bumping industry

Stripper

SPR Series
Bumping Stripper

Bumping strippers are formulated chemicals designed specifically for the removal of wet film and dry film and have less metal damage for bumping process.
Inquiry for technical data sheet

Cleaner

FCS series
Flux Cleaner

FCS series are flux cleaner with the uniquely formulated chemistry designed specially for removal of flux. This excellently performing stripper could rapidly remove flux without damage to Cu and Sn in bumping process.
Inquiry for technical data sheet

Plating

CPM solution
Cu Pillar Bump plating

Pillar bump CPM series solution is formulated chemicals designed specifically for Cu plating in the Pillar Bump process. Pillar bump CPM solution are formulas based on H2SO4, CuSO4 5H2O and organic additives, and provide appropriate secondary current distribution to satisfy bumping process application.
Inquiry for technical data sheet

CPM solution
Cu RDL plating      
                                                                

RDL CPM solution is formulated chemicals designed specifically for Cu plating in the RDL process. RDL CPM solution are formulas based on H2SO4, CuSO4 5H2O and organic additives, and provide appropriate secondary current distribution to satisfy bumping process application.
Inquiry for technical data sheet