關東鑫林科技(KANTO-PPC)在先進無塵室環境中專注生產高純度電子化學品,並建置ppt等級品管實驗室,提供專業的分析服務。面對半導體製程的不斷微縮以及結構和材料的創新需求,我們不斷強化研發軟硬體實力,與客戶攜手共同開發適用於包含EUV製程在內的次世代產品,共同提升本地半導體產業的國際競爭力。






Products for semiconductor industry

Etchant

Al Etch series
Al Etchant

Al Etch series are functional chemicals designed specifically for etching of Al(alloy), Mo(Nb)/Al(Nd), Mo(Nb)/Al(Nd)/Mo(Nb). Al Etch series are formulas based on H3PO4, HNO3 and CH3COOH and provide appropriate etching profile to satisfy process application.
Inquiry for technical data sheet

BOE & BHF Series Etchant

BOE and BHF are formulated chemicals designed specifically for etching of SiO2 and SiN. BHF series etchants contain surfactant, which enhances wettability and achieves etching uniformity. BOE and BHF are formulas based on HF and NH4F.
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HSE Series
High Selective Etchant 

HSE series etchants are formulated chemicals designed specifically for high selective etching for different materials, e.g. SiO2/SiN, TiSi/TiN and Si orientation<111>/<100>.
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Poly series etchant

Poly series etchants are formulated chemicals designed specifically for isotropic etching of Si. Poly series are formulas based on HF and HNO3.
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Stripper

SPR Series
IC Al Process Stripper

SPR 725, SPR 745 and SPR 745T are uniquely formulated chemistry designed specially for removal of positive PR and dry etched PR residue without damage to Al, Cu, Ti, and W for Al process in semiconductor.
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SPR Series
IC Cu Process Stripper

SPR 3100 and SPR 3200 are uniquely formulated chemistry designed specially for removal of dry etched PR residue without damage low-k, Cu, Ta, TaN and SiC in IC Cu process.
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Cleaner

Acidic type post CMP cleaning solution
CMP-M series

CMP-M series post CMP cleaning solution is formulated chemicals designed specifically for post copper and tungsten CMP cleaning. CMP-M series cleaners have outstanding cleaning performance for particles and metals and cost reduction with high dilution ratio, up to 100 times.
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Alkaline type post CMP cleaning solution
CMP-B series

CMP-B series post CMP cleaning solution is formulated chemicals designed specifically for post copper CMP cleaning with cobalt as barrier. CMP-B series cleaners have outstanding cleaning performance for particle, metal, and organic residue. It controls galvanic corrosion to barrier metals. High cost reduction POU dilution ratio more than 100 times.
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Photo ancillaries

IC Developer
ICT-D323T

High purity IC Developer are formulated chemicals designed specifically for positive tone photoresist. The developer is formulas based on high purity TMAH and surfactant, which provides good PR profile after developing.
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Thinner/EBR series

High purity EBC series are formulated chemicals designed specifically for photoresist thinning, EBR remove and PR reducing. The EBC series are formulas based on high purity solvent, which provides good PR solubility.
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Slurry

SLM-200 Series Slurry                                                   

SLM-200 series are colloidal silica-based slurries with the uniquely formulated chemistry designed specially for wafer polishing. SLM-200 series are formulated using colloidal silica with chemical additives to achieve specific performance requirements.
Inquiry for technical data sheet