| product name | description | Inquiry |
|---|---|---|
| Hydrofluoric Acid (HF) | 3nm-130nm | |
| Hydrochloric Acid (HCl) | Used for cleaning silicon wafers and removing metallic impurities. | |
| Ammonium Fluoride (NH4F) | Used in SiO2 and silicate materials etching processes. | |
| Acetic Acid (CH3COOH) | Used in photolithography and cleaning processes to remove organic residues and improve adhesion of photoresists. | |
| Hydrogen Peroxide (H2O2) | 3nm-130nm | |
| Nitric Acid (HNO3) | 3nm-130nm | |
| Phosphoric Acid (H3PO4) | 3nm-130nm | |
| Sulfuric Acid (H2SO4) | 3nm-130nm | |
| Ammonium Hydroxide (NH4OH) | 3nm-130nm | |
| Potassium Hydroxide solution (KOH) | 3nm-130nm | |
| Sodium Hydroxide solution (NaOH) | 3nm-130nm | |
| Tetramethylammonium Hydroxide solution (TMAH) | 3nm-130nm |