| product name | description | Inquiry |
|---|---|---|
| Propylene Glycol Methyl Ether Acetate (PGMEA) | Common solvent in photolithography for photoresists and other materials. | |
| Propylene Glycol Methyl Ether (PGME) | Used as a solvent in photolithography for photoresists and coatings. | |
| n-Methyl-2-Pyrrolidone (NMP) | Solvent used for stripping photoresists and cleaning. | |
| Monoethanolamine (MEA) | Used in cleaning solutions and for removing photoresists. | |
| Methanol | Used for cleaning and as a solvent in various processes. | |
| Dimethyl Sulfoxide (DMSO) | Used as a solvent for various organic compounds and in cleaning processes. | |
| Cyclohexanone | Solvent used in the production of photoresists and for cleaning. | |
| r-Butyrolactone (GBL) | Used as a solvent in photolithography and for cleaning. | |
| Butyl Diglycol (BDG) | Used as a solvent and for cleaning purposes. | |
| Hydrofluoric Acid (HF) | Key etchant for SiO2, used in wafer cleaning and surface preparation. | |
| Hydrochloric Acid (HCl) | Used for cleaning silicon wafers and removing metallic impurities. | |
| Ammonium Fluoride (NH4F) | Used in SiO2 and silicate materials etching processes. |