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Etchant
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Al Etch series
Al Etchant
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Al Etch series are functional chemicals designed specifically for etching
of Al(alloy), Mo(Nb)/Al(Nd), Mo(Nb)/Al(Nd)/Mo(Nb). Al Etch series are formulas
based on H3PO4, HNO3 and CH3COOH and provide appropriate etching profile
to satisfy process application.
Inquiry for technical data sheet
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BOE & BHF Series Etchant
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BOE and BHF are formulated chemicals designed specifically for etching
of SiO2 and SiN. BHF series etchants contain surfactant, which enhances
wettability and achieves etching uniformity. BOE and BHF are formulas based
on HF and NH4F.
Inquiry for technical data sheet
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HSE Series
High Selective Etchant
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HSE series etchants are formulated chemicals designed specifically for
high selective etching for different materials, e.g. SiO2/SiN, TiSi/TiN
and Si orientation<111>/<100>.
Inquiry for technical data sheet
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Poly series etchant
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Poly series etchants are formulated chemicals designed specifically for
isotropic etching of Si. Poly series are formulas based on HF and HNO3.
Inquiry for technical data sheet
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Stripper
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SPR Series
IC Al Process Stripper
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SPR 725, SPR 745 and SPR 745T are uniquely formulated chemistry designed
specially for removal of positive PR and dry etched PR residue without
damage to Al, Cu, Ti, and W for Al process in semiconductor.
Inquiry for technical data sheet
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SPR Series
IC Cu Process Stripper
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SPR 3100 and SPR 3200 are uniquely formulated chemistry designed specially
for removal of dry etched PR residue without damage low-k, Cu, Ta, TaN
and SiC in IC Cu process.
Inquiry for technical data sheet
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Cleaner
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Acidic type post CMP cleaning solution
CMP-M series
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CMP-M series post CMP cleaning solution is formulated chemicals designed
specifically for post copper and tungsten CMP cleaning. CMP-M series cleaners
have outstanding cleaning performance for particles and metals and cost
reduction with high dilution ratio, up to 100 times.
Inquiry for technical data sheet
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Alkaline type post CMP cleaning solution
CMP-B series
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CMP-B series post CMP cleaning solution is formulated chemicals designed
specifically for post copper CMP cleaning with cobalt as barrier. CMP-B
series cleaners have outstanding cleaning performance for particle, metal,
and organic residue. It controls galvanic corrosion to barrier metals.
High cost reduction POU dilution ratio more than 100 times.
Inquiry for technical data sheet
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Photo ancillaries
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IC Developer
ICT-D323T
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High purity IC Developer are formulated chemicals designed specifically
for positive tone photoresist. The developer is formulas based on high
purity TMAH and surfactant, which provides good PR profile after developing.
Inquiry for technical data sheet
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Thinner/EBR series
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High purity EBC series are formulated chemicals designed specifically
for photoresist thinning, EBR remove and PR reducing. The EBC series are
formulas based on high purity solvent, which provides good PR solubility.
Inquiry for technical data sheet
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Slurry
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SLM-200 Series Slurry
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SLM-200 series are colloidal silica-based slurries with the uniquely formulated
chemistry designed specially for wafer polishing. SLM-200 series are formulated
using colloidal silica with chemical additives to achieve specific performance
requirements.
Inquiry for technical data sheet
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