Stripper
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SPR Series Bumping Stripper
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Bumping strippers are formulated chemicals designed specifically for the removal of wet film and dry film and have less metal damage for bumping process. Inquiry for technical data sheet
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Cleaner
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FCS series Flux Cleaner
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FCS series are flux cleaner with the uniquely formulated chemistry designed specially for removal of flux. This excellently performing stripper could rapidly remove flux without damage to Cu and Sn in bumping process. Inquiry for technical data sheet
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Plating
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CPM solution Cu Pillar Bump plating
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Pillar bump CPM series solution is formulated chemicals designed specifically for Cu plating in the Pillar Bump process. Pillar bump CPM solution are formulas based on H2SO4, CuSO4 5H2O and organic additives, and provide appropriate secondary current distribution to satisfy bumping process application. Inquiry for technical data sheet
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CPM solution Cu RDL plating
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RDL CPM solution is formulated chemicals designed specifically for Cu plating in the RDL process. RDL CPM solution are formulas based on H2SO4, CuSO4 5H2O and organic additives, and provide appropriate secondary current distribution to satisfy bumping process application. Inquiry for technical data sheet
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